Name: Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards
Brand: JIMA Copper
SKU: EDCU-HC
Price: 16.00 USD
Availability: InStock

Ana sayfa Ürünler HTE Bakır Folyo

Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

Ürün ayrıntıları:

Place of Origin:	China
Marka adı:	JIMA
Sertifika:	SGS, ISO,Reach, RoHS
Model Number:	EDCU-HC

Ödeme & teslimat koşulları:

Minimum Order Quantity:	200kg
Fiyat:	negotiable
Packaging Details:	Standard wooden carton
Delivery Time:	5-25days
Payment Terms:	T/T, L/C
Supply Ability:	1000 Ton per month

İletişim

Detaylı ürün tanımı

Purity:	99.95%	Thickness:	70um,35um
Color:	red or black	Standard:	IPC-4562
Inter Diameter:	76 Mm，152 Mm， 3 Inch，6 Inch	products name:	Electrolytic HTE Copper Foil with thickness 35um For PCB laminate Multi-layer printed circuit boards Multi-layer PCB
high temperature elongation copper foil:	120 min (180 °C in Atmosphere)
Vurgulamak:	roll of copper foil , electrodeposited copper foil

Electrolytic HTE Copper Foil with thickness 35um For PCB laminate Multi-layer printed circuit boards Multi-layer PCB

Detail Specification:

Single side treatment in red. and single Side Shiny

Thickness: 70um and 35um

Width range: 5-1380mm,and standard width:1290mm,max 1380mm width

high temperature elongation copper foil :120 min (180 °C in Atmosphere)

Internal diameter: 3 inch/6 inch.

Standard :IPC-4562

Classify:

1.(STD-E)- standard electrodeposited copper foil.

2.(HD-E)-high ductility electrodeposited copper foil.

3.(HTE-E)-high temperature elongation electrodeposited copper foil.

Copper foil Application


Application	2>PCB manufacture
	3>antenna PCB
	4>PCB laminate 5>Multi-layer printed circuit boards/Multi-layer PCB

Features and advantages

1.The thermally stable microstructures with their stable mechanical properties

2. Improve dimensional stability

3.Reduce bulging, warping and nail head formation.

These resist thermal outliers which typically occur during laminates.

HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness		um	18	25	35	70	IPC 4562 4.6.3.1
Area weight		g/m²	153±	215±5	285±5	585±8	IPC 4562 4.6.3.2
Roughness	(RA)	μm	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	IPC 4562 4.6.9
Roughness	(RZ)	μm	<8.0	<9.0	≤10.0	<15	IPC 4562 4.6.9
Copper≧		%	99.8				IPC 4562 4.6.3.1
Tensile Strength	state normal	Mpa	>300	>300	>300	>280	IPC 4562 4.6.4
Tensile Strength	state temper (180℃)	Mpa	>18.0	>18.0	>18.0	>18.0	IPC 4562 4.6.4
ElongationI	state normal	%	>5.0	>6.0	>10.0	>10.0	IPC 4562 3.5.3
ElongationI	state temper (180℃)	%	>2.5	>3.0	>5.0	>5.0	IPC 4562 3.5.3
Peel strength		N/mm	>1.35	>1.70	>1.8	>2.0	IPC 4562 4.6.7
High temperature oxidation resistance(200℃, 40min)		No color change					Standard
Solderability		Good					Standard
Solderability		Good					IPC 4562 4.6.12